https://shop.theiet.org:443/editors/alberto-castellazzi-andrea-iraceAlberto Castellazzi, Andrea Iracehttps://shop.theiet.org:443/sic-power-module-design<p xmlns="http://ns.editeur.org/onix/3.0/reference">High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging.</p> <p xmlns="http://ns.editeur.org/onix/3.0/reference">This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs.</p> <p xmlns="http://ns.editeur.org/onix/3.0/reference">Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.</p>Wed, 07 Apr 2021 14:08:29 GMThttps://shop.theiet.org:443/sic-power-module-design